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Senior IC Substrate Package Layout Designer
MaxLinear
Bengaluru / Bangalore
Not Disclosed
4 - 8 Years
Full Time - Permanent
Views:44
Applicants:0
Posted on 20 Jul, 2026
In Office
Job Description | Responsibilities
- Own complete package design activities including die bump planning, pin assignment, floorplanning, package routing, stackup definition, and package signoff
- Perform bump feasibility studies and optimize package architecture for routability, SI/PI performance, manufacturability, reliability, and cost
- Design and implement substrates for FCCSP, HFCBGA/FCBGA, Leadframe, Multi-Chip Modules (MCM), SiP, Interposer, Chiplet-based and advanced 2.5D/3D packages
Overview
- Industry - Transportation Equipment Manufacturing
- Job Role - Other
- Employment type - Full Time - Permanent
- Work Mode - In Office
Qualifications
- Any Graduate - Any Specialization
- Any Post Graduate - Any Specialization
- Any Doctorate - Any Specialization
Job Related Keywords
Senior IC Substrate Package Layout Designer
