Senior IC Substrate Package Layout Designer

• Own complete package design activities including die bump planning, pin assignment, floorplanning, package routing, stackup definition, and package signoff
• Perform bump feasibility studies and optimize package architecture for routability, SI/PI performance, manufacturability, reliability, and cost
• Design and implement substrates for FCCSP, HFCBGA/FCBGA, Leadframe, Multi-Chip Modules (MCM), SiP, Interposer, Chiplet-based and advanced 2.5D/3D packages

Overview

• Industry - Transportation Equipment Manufacturing
• Job Role - Other
• Employment type - Full Time - Permanent
• Work Mode - In Office

Qualifications

• Any Graduate - Any Specialization
• Any Post Graduate - Any Specialization
• Any Doctorate - Any Specialization

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