IC Package Design Engineer

• Design flip-chip IC packages using Cadence APD

• Work on substrate design, DFM/DFA & stack-up rules

• Handle high-speed PCB/package design (DDR, PCIe, SERDES)

• Apply constraints & follow assembly guidelines

Overview

• Industry - IT - Computer Hardware & Peripherals | Networking / Printers / Ink Toners / Other Accessories
• Functional Area - IT Hardware EDA / VLSI / ASIC / Chip Designing / Networking / Remote Sensing
• Job Role - Hardware Design Engineer
• Employment type - Full Time - Permanent
• Work Mode - In Office

Qualifications

• Any Graduate - Any Specialization
• Any Post Graduate - Any Specialization
• Any Doctorate - Any Specialization

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