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Applicants:3
Posted on 30 Aug, 2025
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Key Skills- IC Package Design, Cadence APD, Flip Chip, PCB Design, High-Speed Interfaces, HDI, MCM/3D Packaging, DFM/DFA
Key Skills- Mixed-Signal IC, SERDES, Optical PHY, High-Speed Transceivers, PLL, DLL, ADC, DAC
Key Skills- CMOS memory design, SP/DP SRAM, Register File (RF), ROM design
Key Skills- VLSI, ASIC, Floorplanning, Placement, Routing, Timing Analysis, STA, EDA Tools
Key Skills- N/A